Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9089063 | Method of reducing solder wicking on a substrate | Glen C. Shepherd, Anthony Aaron Lynn Burton, Mimi Munson Tantillo, Dieu-Huong Nguyen Tran | 2015-07-21 | $25,413,000 |
| 8378222 | Method of reducing solder wicking on a substrate | Glen C. Shepherd, Anthony Aaron Lynn Burton, Mimi Munson Tantillo, Dieu-Huong Nguyen Tran | 2013-02-19 | |
| 7645940 | Substrate with via and pad structures | Glen C. Shepherd, Anthony Aaron Lynn Burton, Mimi Munson Tantillo, Dieu-Huong Nguyen Tran | 2010-01-12 | $41,691,000 |