Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10802232 | Strategic placement of plastic structures for EMI management of transceiver module | Tat Ming Teo, John Hsieh, William Wang, Jinxiang Liu, Hon Siu Wee | 2020-10-13 |
| 10371909 | Thermal interface | Julia Koh, Tat Ming Teo, William Wang | 2019-08-06 |
| 10359586 | Strategic placement of plastic structures for EMI management of transceiver module | Tat Ming Teo, John Hsieh, William Wang, Jinxiang Liu, Hon Siu Wee | 2019-07-23 |
| 9572283 | Thermally conductive flexible member for heat transfer | Tat Ming Teo, JianBing Zhao | 2017-02-14 |
| 8913388 | Thermally conductive flexible member for heat transfer | Tat Ming Teo, JianBing Zhao | 2014-12-16 |
| 7955003 | Bail release mechanism for communications module | Tat Ming Teo | 2011-06-07 |