Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8329508 | Semiconductor die packages using thin dies and metal substrates | Hamza Yilmaz, Steven Sapp, Qi Wang, Minhua Li, James J. Murphy | 2012-12-11 |
| 7768075 | Semiconductor die packages using thin dies and metal substrates | Hamza Yilmaz, Steven Sapp, Qi Wang, Minhua Li, James J. Murphy | 2010-08-03 |