Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9856132 | Sealed packaging for microelectromechanical systems | Janusz Bryzek, Cenk Acar | 2018-01-02 |
| 9586813 | Multi-die MEMS package | Janusz Bryzek, Cenk Acar | 2017-03-07 |
| 9352961 | Flexure bearing to reduce quadrature for resonating micromachined devices | Cenk Acar | 2016-05-31 |
| 9156673 | Packaging to reduce stress on microelectromechanical systems | Janusz Bryzek, Cenk Acar | 2015-10-13 |
| 9095072 | Multi-die MEMS package | Janusz Bryzek, Cenk Acar | 2015-07-28 |
| 9062972 | MEMS multi-axis accelerometer electrode structure | Cenk Acar | 2015-06-23 |
| 9006846 | Through silicon via with reduced shunt capacitance | Janusz Bryzek, Cenk Acar | 2015-04-14 |
| 8006557 | Multi-axis sensor | Luzhong Yin, Sandeep Akkaraju, Yie He | 2011-08-30 |