Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6329706 | Leadframe using chip pad as heat conducting path and semiconductor package adopting the same | — | 2001-12-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6329706 | Leadframe using chip pad as heat conducting path and semiconductor package adopting the same | — | 2001-12-11 |