Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7682053 | Light-emitting device with a long lifespan | — | 2010-03-23 |
| 7672130 | Heat dissipating device | — | 2010-03-02 |
| 7635876 | LED package structure and method of packaging the same | — | 2009-12-22 |
| 7576366 | Light-emitting diode chip package body and packaging method thereof | — | 2009-08-18 |
| 7520627 | Backlight module | — | 2009-04-21 |
| 7482637 | Led package and method for producing the same | — | 2009-01-27 |
| 7456437 | LED package and method for producing the same | — | 2008-11-25 |
| 7427805 | Light-emitting diode chip package body and packaging method thereof | — | 2008-09-23 |
| 7411285 | Low profile stacked semiconductor chip package | — | 2008-08-12 |
| 7408370 | Lighting device | — | 2008-08-05 |
| 7399996 | LED package and method for producing the same | — | 2008-07-15 |
| 7383630 | Method for making a circuit plate | — | 2008-06-10 |
| 7339198 | Light-emitting diode chip package body and packaging method thereof | — | 2008-03-04 |
| 7307287 | LED package and method for producing the same | — | 2007-12-11 |
| 7236432 | Apparatus for reading a data storage medium | — | 2007-06-26 |
| 7215017 | Wafer level package, wafer level packaging procedure for making wafer level package | — | 2007-05-08 |
| 7180184 | Conductive bump for semiconductor device and method for making the same | — | 2007-02-20 |
| 7176573 | Semiconductor device with a multi-level interconnect structure and method for making the same | — | 2007-02-13 |
| 7084499 | Semiconductor package and method for making the same | — | 2006-08-01 |
| 7053473 | Compact integrated circuit package | — | 2006-05-30 |
| 6921715 | Semiconductor package and method of fabricating same | — | 2005-07-26 |