Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8889553 | Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method | Wen-Cheng Liu | 2014-11-18 |
| 6508952 | Chemical mechanical abrasive composition for use in semiconductor processing | Tsung-Ho Lee, Tsui-Ping Yeh | 2003-01-21 |
| 6436834 | Chemical-mechanical abrasive composition and method | Tsung-Ho Lee, Tsui-Ping Yeh | 2002-08-20 |