Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12251897 | Method of preparing thick laminate wafers for wafer thermoforming and injection molding | Eric BEGG, Zbigniew Tokarski, Peiqi Jiang | 2025-03-18 |
| 11833772 | Methods, apparatuses, and systems for edge sealing laminate wafers containing a soft deformable inner film | Zbigniew Tokarski, Eric BEGG, Hao-Wen Chiu | 2023-12-05 |