Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142577 | Package comprising metal layer configured for electromagnetic interference shield and heat dissipation | Philipp Michael Jaeger | 2024-11-12 |
| 9253886 | Module and production method | Kim Choong Lee | 2016-02-02 |