GL

Gerd R. Ley

EN Endwave: 1 patents #8 of 13Top 65%
Overall (All Time): #3,527,014 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6640423 Apparatus and method for the placement and bonding of a die on a substrate Edwin F. Johnson, Douglas Gene Lockie, Clifford A. Mohwinkel 2003-11-04