Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12344710 | Semi-crystalline copolyamides, moulding compounds comprising same and their use, and mouldings manufactured from same | Christian Schubert, Ronny Ebling | 2025-07-01 |
| 11453778 | Polyamide moulding compound and its use and mouldings manufactured from the moulding compound | Christian Schubert, Ronny Ebling | 2022-09-27 |
| 11052050 | Loadable polymeric particles for therapeutic and/or diagnostic applications and methods of preparing and using the same | Olaf Fritz, Ulf Fritz | 2021-07-06 |
| 10927254 | Polyamide moulding compounds with low relative permittivity | Georg Stoppelmann, Etienne Aepli, Ronny Ebling | 2021-02-23 |
| 10507608 | Polyamide moulding compounds for large moulded parts | Nikolai Lamberts, Bernd HENKELMANN | 2019-12-17 |
| 10160860 | Reinforced polyamide moulding compositions and injection mouldings produced therefrom | Felix Koch, Botho Hoffmann | 2018-12-25 |
| 9862827 | Polyamide moulding compositions, process for production thereof and use of these polyamide moulding compositions | Andreas Bayer, Botho Hoffmann, Nikolai Lamberts, Manfred Hewel | 2018-01-09 |
| 9845389 | Polyamide molding material, the use thereof, and molded parts produced therefrom | Herbert Mossauer | 2017-12-19 |
| 9815967 | Long-fibre-reinforced polyamides | Mark Pfleghar | 2017-11-14 |
| 9511153 | Loadable polymeric particles for therapeutic and/or diagnostic applications and methods of preparing and using the same | Olaf Fritz, Ulf Fritz | 2016-12-06 |
| 8586662 | Filled polyamide molding materials | Jean-Jacques Linster, Georg Stoppelmann | 2013-11-19 |
| 8324307 | High-temperature polyamide molding compounds reinforced with flat glass fibers | Thomas Jeltsch, Nikolai Lamberts | 2012-12-04 |
| 8318209 | Loadable polymeric particles for therapeutic and/or diagnostic applications and methods of preparing and using the same | Olaf Fritz, Ulf Fritz | 2012-11-27 |
| 8211962 | Filled polyamide molding materials | Nikolai Lamberts | 2012-07-03 |