Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425177 | Method of manufacturing semiconductor device including grinding semiconductor wafer | Tadashi Koyanagi | 2016-08-23 |
| 8215829 | Method of analyzing thermal stress according to filling factor of filler in resin | Tsutomu Kono, Masayuki Mino, Hidehiro Takeshima, Tomoko Goi | 2012-07-10 |
| 8198141 | Intermediate structure of semiconductor device and method of manufacturing the same | Takashi Ohba | 2012-06-12 |
| 6670220 | Semiconductor device and manufacture method of that | Tadaki Sakuraba, Hidehiro Takeshima, Yoshiaki Tamai, Toru Saga | 2003-12-30 |