MK

Mika Kurihara

EL Electroplating Engineers Of Japan Limited: 1 patents #16 of 29Top 60%
📍 Hadano, JP: #606 of 1,025 inventorsTop 60%
Overall (All Time): #3,603,054 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6332963 Cup-type plating apparatus and method for plating wafer using the same Yasuhiko Sakaki 2001-12-25