Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7022402 | Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto | — | 2006-04-04 |
| 5399434 | High temperature polyimide-fluoropolymer laminar structure | Morton Katz | 1995-03-21 |