Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6890635 | Low loss dielectric material for printed circuit boards and integrated circuit chip packaging | Pui-Yan Lin, George Elias Zahr | 2005-05-10 |
| 6835335 | Process for crystallizing at least a portion of a crystallizable condensation homopolymer to form solid particles | Vivek Kapur, Kenneth Wayne Leffew | 2004-12-28 |