Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5400219 | Tape automated bonding for electrically connecting semiconductor chips to substrates | Samuel Reele | 1995-03-21 |
| 5246880 | Method for creating substrate electrodes for flip chip and other applications | Samuel Reele | 1993-09-21 |
| 5235140 | Electrode bump for flip chip die attachment | Samuel Reele | 1993-08-10 |
| 5213676 | Method of generating a substrate electrode for flip chip and other applications | Samuel Reele | 1993-05-25 |
| 5212406 | High density packaging of solid state devices | Samuel Reele | 1993-05-18 |
| 5169056 | Connecting of semiconductor chips to circuit substrates | Samuel Reele | 1992-12-08 |