Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10780454 | Sealant applicator and methods of use | Wayne Summons, Elliot Summons, Kurt Van Ulmer | 2020-09-22 |
| 6369844 | Laser imaging process | Stephen M. Neumann, Terry G. White | 2002-04-09 |
| 6031556 | Overcoat for thermal imaging process | Lee W. Tutt, Mitchell S. Burberry, Vito A. DePalma, William K. Goebel | 2000-02-29 |
| 6007918 | Fuser belts with improved release and gloss | Biao Tan, Jiann-Hsing Chen, Muhammed Aslam, Charles E. Hewitt | 1999-12-28 |
| 5994024 | Method for applying a laminate on a laser ablative recording element | Stephen M. Neumann | 1999-11-30 |
| 5847738 | Process for applying protective overcoat on printed media | Lee W. Tutt | 1998-12-08 |
| 5763358 | Release agents for dye-donor element used in thermal dye transfer | Linda A. Kaszczuk, David B. Bailey, Richard W. Topel, Jr. | 1998-06-09 |
| 5723270 | Photographic elements having a process-surviving polysiloxane block copolymer backing | Thomas M. Smith, Vito A. DePalma | 1998-03-03 |
| 5723271 | Photographic elements having a process-surviving polysiloxane block copolymer backing | Thomas M. Smith, Vito A. DePalma | 1998-03-03 |
| 5712079 | Barrier layer for laser ablative imaging | Douglas R. Robello, Michael Todd Swanson | 1998-01-27 |
| 5672458 | Laser dye or pigment removal imaging process | Lee W. Tutt, Mitchell S. Burberry, Vito A. DePalma, William K. Goebel | 1997-09-30 |
| 5384376 | Organic/inorganic hybrid materials | Gary A. Rakes, Bradley K. Coltrain | 1995-01-24 |
| 5262379 | Color filter array element with polyimide receiving layer | David B. Bailey | 1993-11-16 |
| 5252534 | Slipping layer of polyimide-siloxane for dye-donor element used in thermal dye transfer | Vito A. DePalma, Ravi Sharma, David P. Brust | 1993-10-12 |
| 5135828 | Multiactive electrophotographic element | Hsinjin Yang, David S. Weiss | 1992-08-04 |
| 5122436 | Curable composition | John J. Fitzgerald | 1992-06-16 |
| 5098814 | Laminate for the formation of beam leads for IC chip bonding | John J. Fitzgerald | 1992-03-24 |