Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839024 | Composite and copper clad laminate made therefrom | Yu-Cheng Chen, Mu-Huan Chi, Wei Liu | 2023-12-05 |
| 11466379 | Manufacturing method of copper foil and circuit board assembly for high frequency signal transmission | Fu CHEN, Kuo-Chao Chen | 2022-10-11 |