Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10661394 | Metal core solder ball and heat dissipation structure for semiconductor device using the same | Hyun Kyu Lee, Jung Ug Kwak, Seung Jin Lee, Sang-Ho Jeon, Yong Sik CHOI | 2020-05-26 |
| 8221560 | Lead free solder alloy | Kang-Hee Kim, Myoung Ho Chun, Sang-Ho Jeon, Hyun Kyu Lee | 2012-07-17 |