Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7452610 | Multi-layer polyimide films and flexible circuit substrates therefrom | — | 2008-11-18 |
| 7273661 | Electrically conductive polyimide compositions having a carbon nanotube filler component and methods relating thereto | Hideki Moriyama | 2007-09-25 |
| 6916544 | Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto | Hideki Moriyama, Meredith L. Dunbar, James R. Edman | 2005-07-12 |
| 6908685 | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate | Kouichi Sawasaki, Naofumi Yasuda, Brian C. Auman, John D. Summers | 2005-06-21 |
| 6828390 | Polyimide substrates having an interpenetrating network morphology and methods relating thereto | — | 2004-12-07 |
| 6555238 | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate | Naofumi Yasuda, Kouichi Sawasaki | 2003-04-29 |
| 6548179 | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate | Naofumi Yasuda, Kouichi Sawasaki | 2003-04-15 |
| 6277495 | Polyimide film, a method for its manufacture and a polyimide film containing metal laminated plate | Koichi Sawasaki, Michihiro Kubo | 2001-08-21 |