Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10986293 | Solid-state imaging device including microlenses on a substrate and method of manufacturing the same | Ryohei GORAI | 2021-04-20 |
| 10672928 | Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body | Ryuji Ueda, Takao Tomono, Takehito Tsukamoto | 2020-06-02 |
| 10651320 | Method of manufacturing a circuit board by punching | Ryuji Ueda, Kentaro Kubota, Shigeki Kudo, Minoru Kawasaki | 2020-05-12 |
| 10056517 | Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body | Ryuji Ueda, Takao Tomono, Takehito Tsukamoto | 2018-08-21 |
| 9831567 | Crimp terminal having a conductor crimping part with an intermediate material with recessed parts and a thin-film layer on its top | Daisuke Miyakawa | 2017-11-28 |
| 9478674 | Method of manufacturing a circuit board by punching | Ryuji Ueda, Kentaro Kubota, Shigeki Kudo, Minoru Kawasaki | 2016-10-25 |
| 6438281 | Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the same | Takehito Tsukamoto, Takao Minato, Shigeru Hirayama, Masayuki Ode | 2002-08-20 |