Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7179362 | Electrolyte and method for depositing tin-copper alloy layers | Michael Dietterle, Manfred Jordan | 2007-02-20 |
| 6998036 | Electrolyte and method for depositing tin-silver alloy layers | Michael Dietterle, Manfred Jordan | 2006-02-14 |
| 6770185 | Aqueous solution for electrodepositing tin-zinc alloys | Manfred Jordan | 2004-08-03 |
| 4650548 | Process for preserving the solderability of through hole plated printed circuit boards | Manfred Jordan | 1987-03-17 |