BK

Bongkeun Kim

Dow Global Technologies: 4 patents #1,176 of 4,534Top 30%
RM Rohm And Haas Electronic Materials: 3 patents #209 of 562Top 40%
University of California: 3 patents #2,984 of 18,278Top 20%
Samsung: 1 patents #49,284 of 75,807Top 70%
Overall (All Time): #916,738 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
12380266 Layout design method and method of manufacturing integrated circuit device using the same Dawoon Choi, Inseop Lee, Hee-Don Jeong, Myungsoo Noh 2025-08-05
10351727 Copolymer formulation for directed self-assembly, methods of manufacture thereof and articles comprising the same Phillip D. Hustad, Peter Trefonas, III, Valeriy V. Ginzburg, Glenn H. Fredrickson 2019-07-16
9840637 Copolymer formulation for directed self-assembly, methods of manufacture thereof and articles comprising the same Phillip D. Hustad, Peter Trefonas, III, Valeriy V. Ginzburg, Glenn H. Fredrickson 2017-12-12
9772554 Copolymer formulation for directed self-assembly, methods of manufacture thereof and articles comprising the same Phillip D. Hustad, Peter Trefonas, III, Valeriy V. Ginzburg, Glenn H. Fredrickson 2017-09-26
9765214 Copolymer formulation for directed self-assembly, methods of manufacture thereof and articles comprising the same Phillip D. Hustad, Peter Trefonas, III, Valeriy V. Ginzburg, Glenn H. Fredrickson 2017-09-19