KM

Katsutoshi Mine

DC Dow Corning Toray Silicone Company: 50 patents #4 of 246Top 2%
TC Toray Silicone Co.: 11 patents #7 of 116Top 7%
DC Dow Corning Toray Co.: 3 patents #62 of 258Top 25%
Dow Corning: 2 patents #658 of 1,768Top 40%
DC Dow Corning Toray Silcone Co.: 2 patents #7 of 44Top 20%
Overall (All Time): #29,549 of 4,157,543Top 1%
70
Patents All Time

Issued Patents All Time

Showing 26–50 of 70 patents

Patent #TitleCo-InventorsDate
6231974 Hot-melt adhesive sheet and semiconductor devices Kimio Yamakawa, Minoru Isshiki, Yoshiko Otani 2001-05-15
6225433 Curable silicone composition and electronic components Minoru Isshiki, Yoshiko Otani, Kimio Yamakawa 2001-05-01
6214748 Semiconductor device and method for the fabrication thereof Akihiko Kobayashi, Takashi Nakamura, Motoshi Sasaki, Kiyotaka Sawa 2001-04-10
6191183 Method for the formation of silica thin films Akihiko Kobayashi, Takashi Nakamura, Motoshi Sasaki, Kiyotaka Sawa 2001-02-20
6149966 Composition and process for forming electrically insulating thin films Akihiko Kobayashi, Takashi Nakamura, Motoshi Sasaki, Kiyotaka Sawa 2000-11-21
6074695 Composition and process for forming electrically insulating thin films Akihiko Kobayashi, Takashi Nakamura, Motoshi Sasaki, Kiyotaka Sawa 2000-06-13
6039831 Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices Osamu Mitani, Kazumi Nakayoshi, Rikako Tazawa 2000-03-21
6040362 Heat-conducting polymer composition Osamu Mitani, Kazumi Nakayoshi, Rikako Tazawa 2000-03-21
6040395 Electrical components and method for the fabrication thereof Minoru Isshiki, Kimio Yamakawa 2000-03-21
6025435 Thermal conductive silicone rubber composition Kimio Yamakawa, Noriyasu Yokoyama 2000-02-15
6017587 Electrically conductive silicone compositions Don Lee Kleyer, Michael A. Lutz, Osamu Mitani, Kazumi Nakayoshi, Bernard VanWert 2000-01-25
5989942 Method for fabricating semiconductor device Takae Ishikawa, Hiroyosi Naito, Kimio Yamakawa 1999-11-23
5982041 Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices Osamu Mitani, Kazumi Nakayoshi, Rikako Tazawa 1999-11-09
5958176 Electrical parts and method for manufacturing the same Minoru Isshiki, Kimio Yamakawa 1999-09-28
5958515 Electrical components and method for the fabrication thereof Minoru Isshiki, Kimio Yamakawa 1999-09-28
5932145 Addition reaction-curing electrically conductive silicone composition and method for the preparation thereof Osamu Mitani, Kazumi Nakayoshi, Rikako Tazawa 1999-08-03
5907190 Semiconductor device having a cured silicone coating with non uniformly dispersed filler Takae Ishikawa, Hiroyosi Naito, Kimio Yamakawa 1999-05-25
5891969 Epoxy resin and epoxy-functional organopolysiloxane Takae Takeuchi, Kimio Yamakawa 1999-04-06
5877228 Method for curing ultraviolet-curable silicone compositions Hiroyoshi Naito, Kimio Yamakawa 1999-03-02
5872194 Curable liquid-form composition, cured product of the same, and electronic part Minoru Isshiki, Kimio Yamakawa 1999-02-16
5872170 Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices Osamu Mitani, Kazumi Nakayoshi, Rikako Tazawa 1999-02-16
5804631 Curable organosiloxane compositions and semiconductor devices Osamu Mitani, Kazumi Nakayoshi, Rikako Tazawa 1998-09-08
5708054 Two-part curable liquid silicone composition Takae Takeuchi, Kimio Yamakawa 1998-01-13
5561329 Compositions for protecting semiconductor elements and semiconductor devices Hiroyoshi Naito, Kimio Yamakawa 1996-10-01
5486564 High purity polyhydrogen silsesquioxane resin for electronic coatings Takashi Nakamura, Motoshi Sasaki 1996-01-23