Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278117 | Underfill film for semiconductor package and method for manufacturing semiconductor package using the same | Taejin CHOI, Chunggu Lee, Jungjin Lee | 2025-04-15 |
| 11942336 | Underfill film for semiconductor package and method for manufacturing semiconductor package using the same | Taejin CHOI, Chunggu Lee, Jungjin Lee | 2024-03-26 |