Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7307015 | Method for forming an interconnection line in a semiconductor device | — | 2007-12-11 |
| 7271091 | Method for forming metal pattern to reduce contact resistivity with interconnection contact | — | 2007-09-18 |
| 7186644 | Methods for preventing copper oxidation in a dual damascene process | — | 2007-03-06 |
| 7183218 | Methods for fabricating a semiconductor device with etch end point detection | — | 2007-02-27 |
| 6995082 | Bonding pad of a semiconductor device and formation method thereof | — | 2006-02-07 |
| 6972242 | Methods to fabricate semiconductor devices | — | 2005-12-06 |