Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7701044 | Chip package for image sensor and method of manufacturing the same | San-deok Hwang | 2010-04-20 |
| 7510902 | Image sensor chip package and method of fabricating the same | — | 2009-03-31 |
| 7372122 | Image sensor chip package and method of fabricating the same | — | 2008-05-13 |
| 7229849 | Method for packaging a semiconductor device | — | 2007-06-12 |
| 7119001 | Semiconductor chip packages and methods for fabricating the same | — | 2006-10-10 |
| 6953710 | Method for packaging a semiconductor device | — | 2005-10-11 |
| 6836961 | Ceramic packaging method employing flip-chip bonding | — | 2005-01-04 |