Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6861464 | Two component, curable, hot melt adhesive | Rajan Eadara, Mooil CHUNG, David Wen-Lung Chang, Sunny K. George, Patrick A. Ohaka +1 more | 2005-03-01 |
| 6734263 | Non-polyvinyl chloride, interpenetrating network epoxy/urethane acrylates | Rajan Eadara, Roy Jacob, Biju Philip, Jori Joseff | 2004-05-11 |