Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11643325 | Micro-electromechanical system package having movable platform | Chih-Ming Sun, Ming-Han Tsai | 2023-05-09 |
| 11465901 | Sensor package having a movable sensor | Chih-Ming Sun, Ming-Han Tsai | 2022-10-11 |
| 11326972 | Pressure sensor with improve hermeticity | Pei-Wen Yen, Chung-Hsien Lin | 2022-05-10 |
| 10858238 | Sensor package having a movable sensor | Chih-Ming Sun, Ming-Han Tsai | 2020-12-08 |
| 10589982 | Sensor package having a movable sensor | Chih-Ming Sun, Ming-Han Tsai | 2020-03-17 |
| 10384928 | Manufacturing method of sensor package | Chih-Ming Sun, Ming-Han Tsai | 2019-08-20 |
| 8261428 | Method for assembling a 3-dimensional microelectrode structure | Weileun Fang, Yen-Chung Chang | 2012-09-11 |