Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125835 | Module package with high illumination efficiency | Sai Mun Lee | 2024-10-22 |
| 12117337 | Opto-mechanical structure design of thin LGA package with glass cover | Sai Mun Lee | 2024-10-15 |
| 11754440 | Opto-mechanical structure design of thin LGA package with glass cover and a thickness of an aperture ceiling is 0.20MM | Sai Mun Lee | 2023-09-12 |
| 11562992 | Image module package having glass filter secured by transparent adhesive | Sai Mun Lee | 2023-01-24 |
| 10937773 | Image module package having flat glass filter flush with transparent layer | Sai Mun Lee | 2021-03-02 |
| 10211191 | Image module package with transparent sub-assembly | Sai Mun Lee | 2019-02-19 |
| 10026765 | Apparatus and sensor chip component attaching method | Sai Mun Lee | 2018-07-17 |