Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8025553 | Back grinding method for wafer | Kazuma Sekiya, Yusuke Kimura, Takashi Mori | 2011-09-27 |
| 7682224 | Method of machining substrate | Yusuke Kimura, Takashi Mori | 2010-03-23 |