Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354916 | Method of processing wafer | Hayato IGA, Kazuya Hirata | 2025-07-08 |
| 12311470 | Method of processing monocrystalline silicon wafer | Hayato IGA, Kazuya Hirata | 2025-05-27 |
| 12315716 | Wafer processing method | — | 2025-05-27 |
| 11471991 | Method of processing workpiece | Shuzo MITANI, Yuya MATSUOKA | 2022-10-18 |
| 9586331 | Disk-shaped workpiece dividing method | — | 2017-03-07 |
| 8486806 | Method for machining wafers by cutting partway through a peripheral surplus region to form break starting points | — | 2013-07-16 |