Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394658 | Method of processing plate-shaped workpiece | Kosei Kiyohara, Shohei Takeda, Gentaro TSURUTA | 2025-08-19 |
| 11945074 | Processing apparatus | — | 2024-04-02 |
| 11810807 | Processing apparatus configured for processing wafers continuously under different processing conditions | Akiko Kigawa | 2023-11-07 |
| 11731239 | Processing apparatus | — | 2023-08-22 |
| 11667003 | Processing apparatus | Tetsuo Kubo | 2023-06-06 |
| 11577363 | Grinding method of bonded workpiece obtained by bonding transparent components or semitransparent components to each other | — | 2023-02-14 |
| 11389927 | Processing apparatus | Souichi MATSUBARA, Suzu Hoshino, Hidekazu Nakayama | 2022-07-19 |
| 10896830 | Separating apparatus | — | 2021-01-19 |
| 10283387 | Peeling apparatus | — | 2019-05-07 |
| 9360773 | Mark detecting method | — | 2016-06-07 |