Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12379272 | Apparatus and method for detecting tension abnormality in dicing tape | — | 2025-08-05 |
| 12368064 | Tape affixing apparatus | — | 2025-07-22 |
| 7897000 | Adhesive film bonding method | Hiroshi Nakamura | 2011-03-01 |
| 7804156 | Semiconductor wafer assembly and method of processing semiconductor wafer | Satoshi Yamanaka | 2010-09-28 |