Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12427604 | Processing method and processing apparatus for ingot | Yujiro SUDO, Kazuya Hirata, Kunimitsu Takahashi | 2025-09-30 |
| 11901231 | Separation method of wafer | Kazuya Hirata | 2024-02-13 |
| 11881407 | Processed wafer and method of manufacturing chip formation wafer | Masatake Nagaya, Teruaki KUMAZAWA, YUJI NAGUMO, Kazuya Hirata | 2024-01-23 |
| 10950462 | Diamond substrate producing method | Kazuya Hirata | 2021-03-16 |