Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5285347 | Hybird cooling system for electronic components | Paul Wade | 1994-02-08 |
| 5184211 | Apparatus for packaging and cooling integrated circuit chips | — | 1993-02-02 |
| 5010038 | Method of cooling and powering an integrated circuit chip using a compliant interposing pad | Paul Wade, William L. Schmidt | 1991-04-23 |
| 4954878 | Method of packaging and powering integrated circuit chips and the chip assembly formed thereby | Paul Wade, William L. Schmidt | 1990-09-04 |
| 4833567 | Integral heat pipe module | Elric W. Saaski, Robert J. Hannemann | 1989-05-23 |