Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D574110 | Comb | — | 2008-07-29 |
| 5097387 | Circuit chip package employing low melting point solder for heat transfer | — | 1992-03-17 |
| 4445919 | In situ rapid wash apparatus and method | William Cole, Drew P. O'Connell | 1984-05-01 |
| 4234106 | Fuel delivery system for a furnace or kiln | Donald E. Rywak, Frederick D. Rhodes, Otto Kovalsics | 1980-11-18 |