Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10470312 | Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit | Sunao Yoshihara, Haruhiko Katsuta, Yoshinori Katayama, Jun Shirakami, Akira Murakawa +1 more | 2019-11-05 |
| 9650522 | Absorbing-layer-forming composition and absorbing substrate, printed item, conductive pattern, and electric circuit produced using the same | Wataru Fujikawa, Jun Shirakami, Akira Murakawa | 2017-05-16 |
| 9629253 | Method for forming high-definition metal pattern, high-definition metal pattern, and electronic component | Sunao Yoshihara, Haruhiko Katsuta, Yoshinori Katayama, Jun Shirakami, Akira Murakawa +1 more | 2017-04-18 |
| 9380701 | Laminate, conductive pattern, and method for producing laminate | Akira Murakawa, Jun Shirakami, Wataru Fujikawa | 2016-06-28 |
| 9374895 | Laminate, conductive pattern, electrical circuit, and method for producing laminate | Akira Murakawa, Jun Shirakami, Wataru Fujikawa | 2016-06-21 |
| 8784956 | Resin composition for forming receiving layer, and receiving substrate; printed matter, conductive pattern, and electric circuit produced by using the resin composition | Wataru Fujikawa, Jun Shirakami | 2014-07-22 |