AM

Akinori Morino

DI Dic: 5 patents #111 of 844Top 15%
OU Osaka City University: 3 patents #5 of 71Top 8%
Overall (All Time): #980,885 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
10426044 Thermosetting adhesive sheet, reinforcement-part-equipped flexible printed circuit, method for manufacturing reinforcement-part-equipped flexible printed circuit, and electronic device Koji Hayashi, Sumio Shimooka, Shota Tanii 2019-09-24
10301515 Easily dismantlable adhesive composition and easily dismantlable adhesive tape Akikazu Matsumoto, Eriko Sato, Koujirou Tanaka 2019-05-28
9321944 Easily dismantlable adhesive agent composition and easily dismantlable adhesive tape Akikazu Matsumoto, Eriko Sato, Koujirou Tanaka 2016-04-26
9206340 Easily dismantlable adhesive composition and easily dismantlable adhesive tape Akikazu Matsumoto, Eriko Sato, Koujirou Tanaka 2015-12-08
8394888 Aqueous dispersion type acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive tape Naoki Kato 2013-03-12