Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392762 | Soil sensor | Kei Shimakura | 2025-08-19 |
| 9831146 | Molded package | — | 2017-11-28 |
| 9528930 | Adhering matter determination device | Junichi Ishikawa, Jun Tarui, Kiyoshi Otsuka, Makiko Sugiura, Takahiko Yoshida | 2016-12-27 |