TO

Tameharu Ohta

DE Denso: 22 patents #341 of 11,792Top 3%
TO Toyota: 3 patents #8,352 of 26,838Top 35%
Overall (All Time): #196,793 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Showing 1–22 of 22 patents

Patent #TitleCo-InventorsDate
9366534 Physical quantity sensor and method of making the same Tetsuo Fujii, Masanobu Azukawa, Takeshi Ito, Itaru Ishii 2016-06-14
8601871 Physical quantity sensor and method of making the same Tetsuo Fujii, Masanobu Azukawa, Takeshi Ito, Itaru Ishii 2013-12-10
8578774 Physical quantity sensor including bonding wire with vibration isolation performance characteristics Takeshi Shinoda, Itaru Ishii, Keisuke Nakano 2013-11-12
8359923 Physical quantity sensor Tetsuo Fujii, Masanobu Azukawa, Takeshi Ito, Itaru Ishii 2013-01-29
8143083 Physical quantity sensor device and method for producing the same 2012-03-27
7891244 Method of making a physical quantity sensor Tetsuo Fujii, Masanobu Azukawa, Takeshi Ito, Itaru Ishii 2011-02-22
7750486 Sensor device having stopper for limitting displacement 2010-07-06
7603903 Vibration-type angular rate sensor 2009-10-20
7497117 Angular velocity mount arrangement 2009-03-03
7468552 Physical quantity sensor 2008-12-23
7464592 Physical quantity sensor 2008-12-16
7385296 Sensor device having stopper for limitting displacement 2008-06-10
7268435 Capacitive semiconductor sensor 2007-09-11
7243545 Physical quantity sensor having spring Minekazu Sakai 2007-07-17
7234364 Angular rate sensor having circuit board and package 2007-06-26
7059190 Semiconductor dynamic sensor having variable capacitor formed on laminated substrate Minekazu Sakai 2006-06-13
6935176 Capacitive dynamic quantity sensor device Keisuke Goto 2005-08-30
6876093 Capacitance type dynamic quantity sensor device Keisuke Goto 2005-04-05
6060780 Surface mount type unit and transducer assembly using same Tomohito Kunda 2000-05-09
6035712 Sensor device and method of producing the same using lead frame Hiromi Ariyoshi 2000-03-14
5901046 Surface mount type package unit and method for manufacturing the same Takashi Yamasaki, Kenichi Gohara 1999-05-04
5796310 Amplification circuit using wire-bonding for adjusting amplification factor Hiromi Ariyosi 1998-08-18