Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8758087 | Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus | Kyohei KOUTAKE, Hiromichi Morita, Fumiyoshi Kano, Tetsuji Yamaguchi, Masatake Nagaya | 2014-06-24 |
| 7091109 | Semiconductor device and method for producing the same by dicing | Tetsuo Fujii, Hiroshi Muto, Shinji Yoshihara | 2006-08-15 |
| 6495796 | High density energy beam machining method and apparatus for the same | Terukazu Fukaya, Takashi Nakayama, Michio Kameyama, Seiji Tachibana | 2002-12-17 |
| 6429506 | Semiconductor device produced by dicing | Tetsuo Fujii, Tsuyoshi Fukada, Hiroshi Muto, Kenichi Ao, Shinji Yoshihara | 2002-08-06 |
| 6255741 | Semiconductor device with a protective sheet to affix a semiconductor chip | Shinji Yoshihara, Kinya Atsumi, Minekazu Sakai, Yasuki Shimoyama, Tetsuo Fujii | 2001-07-03 |
| 5824177 | Method for manufacturing a semiconductor device | Shinji Yoshihara, Fumio Ohara, Takashi Kurahashi | 1998-10-20 |