Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6369332 | Metal-base multilayer circuit substrate with heat conducting adhesive | Naomi Yonemura, Tomohiro Miyakoshi, Makoto Fukuda | 2002-04-09 |
| 6175084 | Metal-base multilayer circuit substrate having a heat conductive adhesive layer | Naomi Yonemura, Tomohiro Miyakoshi, Makoto Fukuda | 2001-01-16 |