Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12221534 | Composition | Tometomo UCHIDA, Takashi Domoto, Takako TANIGAWA, Kenji Nomura | 2025-02-11 |
| 11945891 | Speaker having an adhesive composition | Hideki Hayashi, Chiaki Takano | 2024-04-02 |
| 11787951 | Photocurable composition for three-dimensional molding, three-dimensional molded product, and method for producing three-dimensional molded product | Takashi Domoto | 2023-10-17 |
| 10683414 | Resin composition | Takako Hoshino, Yuki Hisha | 2020-06-16 |
| 10647889 | Adhesive composition | Hayato Miyazaki, Kenji Fukao, Hiroki UNO | 2020-05-12 |
| 10490243 | Memory device and information processing apparatus | — | 2019-11-26 |
| 10273389 | Resin composition | Takako Hoshino, Kimihiko Yoda | 2019-04-30 |
| 10224078 | Semiconductor device and refresh rate control method of semiconductor device based on measured temperature | Makoto Suwada | 2019-03-05 |
| 9921779 | Memory apparatus, memory system and memory controlling method | Osamu Ishibashi, Sadao Miyazaki, Jin Abe, Masaru Itoh | 2018-03-20 |
| 9067398 | Method for disassembling bonded body, and adhesive | Hiroyuki Kurimura, Isamu Ichikawa | 2015-06-30 |
| 8845858 | Method for separating bonded bodies using excimer light irradiation | Jun Watanabe, Norihiro Shimizu, Hiroyuki Kurimura, Isamu Ichikawa, Kenji Fukao +1 more | 2014-09-30 |
| 8723537 | Probe inspecting method and curable resin composition | Gosuke Nakajima, Kazuhiro Oshima, Jun Watanabe | 2014-05-13 |
| 8278408 | Resin composition | Shigeo Hiyama, Takuya Okada, Jun Watanabe | 2012-10-02 |
| 7865656 | Storage controller and storage control method | — | 2011-01-04 |
| 7315798 | Method of identifying boundary condition between components of object of analysis | Tatsuyuki Amago, Yoshio Kojima, Mizuho Inagaki, Kazuaki Chiku, Toru Matsushima +1 more | 2008-01-01 |