Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11951271 | Method of manufacturing an in-plane metal microneedle array | Guojun Ma, Xiaolong An, Xiao Han, Wei Zhang, Yongtao LV +1 more | 2024-04-09 |
| 11860187 | Modified method to fit cell elastic modulus based on Sneddon model | Wei Zhang, Weihao Sun, Jianli Ma | 2024-01-02 |
| 11738185 | In-plane metal microneedle array and manufacturing method therefor | Guojun Ma, Yuting Niu, Wei Zhang, Yongtao LV, Xiao Han +1 more | 2023-08-29 |
| 11658137 | Semiconductor package | — | 2023-05-23 |
| 10957662 | Semiconductor package | — | 2021-03-23 |
| 10541217 | Semiconductor package | — | 2020-01-21 |
| 10283467 | Semiconductor package | — | 2019-05-07 |
| 9679872 | Connection structure for semiconductor package having plural vias located within projection of conductive unit | — | 2017-06-13 |