Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12017470 | Resin composition for back-surface layer and heat-sensitive transfer recording material | Takeshi Kawaguchi, Motoaki Umezu | 2024-06-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12017470 | Resin composition for back-surface layer and heat-sensitive transfer recording material | Takeshi Kawaguchi, Motoaki Umezu | 2024-06-25 |