Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198834 | Resin composition and moulded article | Junya Iida, Koji Nakanishi, Hideki Kono | 2025-01-14 |
| 11939450 | Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board | Hirofumi MUKAE, Hirokazu Komori, Masaji Komori, Hideki Kono | 2024-03-26 |
| 11472953 | Resin composition and molded body | Shuhei Yamaguchi, Masaji Komori, Hideki Kono | 2022-10-18 |