Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6658734 | Method of manufacturing a circuit member for a resin-sealed semiconductor device | Makoto Nakamura, Takayuki Takeshita, Hiroshi Yagi | 2003-12-09 |
| 6465734 | Resin sealed semiconductor device, circuit member for use therein and method of manufacturing circuit member | Makoto Nakamura, Takayuki Takeshita, Hiroshi Yagi | 2002-10-15 |
| 6359221 | Resin sealed semiconductor device, circuit member for use therein | Makoto Nakamura, Takayuki Takeshita, Hiroshi Yagi | 2002-03-19 |