Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7887313 | Mold apparatus for resin encapsulation and resin encapsulation method | Kenji Ogata, Kenichiro Imamura | 2011-02-15 |
| 7662612 | Chemical sensor device | Kazuhiro Niwa, Toru Onouchi | 2010-02-16 |
| 7413425 | Resin sealing mold and resin sealing method | Kenji Ogata, Yoshihiro Mitsui | 2008-08-19 |
| 7008575 | Resin sealing mold and resin sealing method | Kenji Ogata, Yoshihiro Mitsui | 2006-03-07 |