Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11957065 | Systems and methods for fabrication of superconducting integrated circuits | Shuiyuan Huang, Byong Hyop Oh, Douglas P. Stadtler, Edward G. Sterpka, Paul I. Bunyk +7 more | 2024-04-09 |
| 11276643 | Semiconductor device with backside spacer and methods of forming the same | Po-Yu Huang, Fu-Kai Yang, Mei-Yun Wang | 2022-03-15 |
| 11038095 | Systems and methods for fabrication of superconducting integrated circuits | Shuiyuan Huang, Byong Hyop Oh, Douglas P. Stadtler, Edward G. Sterpka, Paul I. Bunyk +7 more | 2021-06-15 |
| 9634224 | Systems and methods for fabrication of superconducting circuits | Eric Ladizinsky, Nicolas C. Ladizinsky, Byong Hyop Oh, Richard D. Neufeld | 2017-04-25 |
| 6573156 | Low defect method for die singulation and for structural support for handling thin film devices | David Xuan-Qi Wang | 2003-06-03 |